Hitachi Power Solutions launches Scanning Acoustic Tomograph

Improving quality inspection accuracy of semiconductor devices, electronic components becoming finer and more multilayered, and large wafers.

Hitachi Power Solutions Co., Ltd. (Hitachi Power Solutions), had announced the launch of Scanning Acoustic Tomograph “FineSAT7” from October 1, as the newest model of FineSAT series of devices that detects and images minute structures and defects*1 such as delamination and voids inside semiconductors and electronic components nondestructively by utilizing the reflective and transmissive properties of ultrasonic wave. It enables high-quality defect-detection images and one-time inspection of 300 mm (12-inch) wafers by adopting an A/D conversion board*2 with the resolution by 16 times and the measuring period by twice compared to the conventional model. FineSAT7 will contribute to improve inspection accuracy and productivity in research, development, and manufacturing fields through these performances and functions.

Features of FineSAT7

1) Higher-quality defect-detection images using an in-house developed A/D conversion board

It has improved the accuracy*4 of feature extraction after digital processing through adopting an A/D conversion board with the resolution by 16 times and the measuring period by twice compared to the conventional model. In addition, using a technique*5 that adds and averages ultrasonic waveforms from eight locations around a pixel’s brightness, we can reduce random noise caused by thermal noise in electronic circuits and other factors, thereby improving the quality of defect-detected images.

2) Larger water tank realizes one-time inspection of 300 mm (12-inch) wafers using the through transmission method

Conventionally, inspection of 300 mm wafers using the through transmission method had to be performed half-side by side while moving the inspection object. This time, the water tank that measures the object is made larger by reviewing the equipment layout in SAT7, and expanded the motion range of the measurement equipment including the probe*6 that transmits and receives ultrasonic waves. As a result, it is possible to inspect the entire 300 mm wafer at once.
Larger water tank also improves workability, such as moving objects to be inspected in a water tank and removing bubbles that cause reflection of ultrasonic waves.

FineSAT7 complies with standards for the safety of semiconductor-manufacturing equipment set out by Semiconductor Equipment and Materials International (SEMI)

For More information https://www.hitachi.com/